Researchers Database

ZhanTianzhuo

    Graduate School of Interdisciplinary New Science Associate Professor
    Bio-Nano Electronics Research Center Associate Professor
    Course of Bio-Nano Science Fusion Associate Professor
Last Updated :2022/05/07

Researcher Information

Research funding number

  • 00803389

ORCID ID

J-Global ID

Research Interests

  • Thermal management   Thermal boundary resistance   Nanoscale thermal transport   Thermoelectric device   

Research Areas

  • Nanotechnology/Materials / Applied physics - general / Thermal management
  • Nanotechnology/Materials / Thin-film surfaces and interfaces / Thermal boundary resistance
  • Nanotechnology/Materials / Nanomaterials / Thermoelectric device
  • Nanotechnology/Materials / Nanostructure physics / Nanoscale thermal transport

Academic & Professional Experience

  • 2021/04 - Today  Toyo UniversityGraduate School of Interdisciplinary New Science特任准教授
  • 2020/04 - 2021/03  Waseda UniversityComprehensive Research Organization主任研究員
  • 2017/04 - 2020/03  Waseda UniversityComprehensive Research Organization次席研究員
  • 2012/04 - 2017/03  National Institute for Materials Scienceポスドク研究員

Association Memberships

  • JAPAN SOCIETY OF THERMOPHYSICAL PROPERTIES   THE JAPAN SOCIETY OF APPLIED PHYSICS   

Published Papers

Conference Activities & Talks

  • Modification of thermal boundary resistance for thermal management of interconnect system in advanced VLSI circuits  [Invited]
    Tianzhuo Zhan
    The 18th International Symposium on Bioscience and Nanotechnology  2021/12
  • Effect of Thermal Boundary Resistance in Metal/Dielectric Heat Guide Layers on Power Generation of Microthermoelectric Generators  [Not invited]
    ジャン 天卓
    第26回 電子デバイス界面テクノロジー研究会  2021/01
  • マイクロ熱電発電素子のための低熱抵抗金属/絶縁体積層薄膜の開発  [Invited]
    詹 天卓
    電子情報通信学会研究会-シリコン材料・デバイス研究会  2020/02
  • 銅配線の温度上昇に及ぼす界面熱抵抗の影響  [Not invited]
    詹 天卓
    第25回 電子デバイス界面テクノロジー研究会-材料・プロセス・デバイス特性の物理  2020/01
  • Effect of Thermal Boundary Resistance at Metal/Dielectric Interfaces on Output Power in Silicon Nanowire Thermoelectric Generator  [Not invited]
    詹 天卓
    2019 International Workshop on Dielectric Thin Films for Future Electron Devices-Science and Technology  2019/11
  • Power enhancement of silicon nanowire thermoelectric generator by using metal/dielectric thermally conductive layer  [Not invited]
    Tianzhuo Zhan
    2019 International Conference on Solid State Devices and Materials  2019/09
  • CMOS-compatible substrate-supported silicon nanowire micro thermoelectric energy harvester  [Invited]
    Tianzhuo Zhan
    BIT’s 8th Annual World Congress of Advanced Materials  2019/07
  • Metal/insulator thermally conductive layers for thermoelectric energy harvesting applications  [Not invited]
    Tianzhuo Zhan
    European Materials Research Society 2019 Spring Meeting  2019/05
  • 金属/絶縁体積層熱伝導層の熱抵抗  [Not invited]
    詹 天卓
    第24回 電子デバイス界面テクノロジー研究会-材料・プロセス・デバイス特性の物理  2019/01
  • Large size freestanding diamond substrate with high thermal conductivity fabricated by a two-step micropattern heteroepitaxial growth method  [Not invited]
    Tianzhuo Zhan
    The 29th International Conference on Diamond and Carbon Materials  2018/09
  • 金属/絶縁体複合熱伝導層の熱伝導率  [Not invited]
    詹天卓
    第79回応用物理学会秋季学術講演会  2018/09
  • AlN熱伝導膜の熱伝導率向上によるSiナノワイヤ熱電発電デバイスの出力向上  [Not invited]
    詹天卓
    第23回 電子デバイス界面テクノロジー研究会 ―材料・プロセス・デバイス特性の物理  2018/01
  • Enhancement of thermoelectric power of a Si nanowire micro thermoelectric generator by improving the thermal conductivity of AlN thermally conductive film  [Not invited]
    Tianzhuo Zhan
    Power MEMS 2017  2017/11
  • Thermal boundary resistance at Au/Ge/Ge and Au/Si/Ge interfaces  [Not invited]
    Tianzhuo Zhan
    The 6th International Symposium on Micro and Nano Technology  2017/03
  • Thermal boundary resistance at Au/Ge/Ge and Au/Si/Ge interfaces  [Not invited]
    Tianzhuo Zhan
    2015 MRS Fall Meeting  2015/11
  • Au/Ge/Ge 及び Au/Si/Geの界面熱抵抗  [Not invited]
    詹天卓
    第36回 日本熱物性学会  2015/10
  • Thermal boundary resistance at Au/Ge/Ge and Au/Si/Ge interfaces  [Not invited]
    Tianzhuo Zhan
    The 6th International Conference on Nanoscience and Technology  2015/09
  • Thermal conductivity of sputtered amorphous Ge films  [Not invited]
    Tianzhuo Zhan
    The 4th International Symposium on Micro and Nano Technology  2013/10
  • Thermal conductivity of sputtered amorphous Ge films  [Not invited]
    Tianzhuo Zhan
    The 12th International Conference on Advanced Materials  2013/09
  • Thermal conductivity of sputtered amorphous Si films  [Not invited]
    Tianzhuo Zhan
    The 10th Asia Thermophysical Properties Conference  2013/09
  • Thermal conductivity of Ge thin film on Si substrate  [Not invited]
    Tianzhuo Zhan
    2013 MRS Spring Meeting  2013/04
  • Si基板上のGe薄膜の熱伝導率  [Not invited]
    詹天卓
    第33回 日本熱物性学会  2012/10
  • Enhancement of impact-induced mechanoluminescence for structure health monitoring using swift heavy ion irradiation  [Not invited]
    Tianzhuo Zhan
    Behavior and Mechanics of Multifunctional Materials and Composites 2012  2012/03
  • Direct visualization of ultrasonic power distribution using mechanoluminescent sensing film  [Not invited]
    Tianzhuo Zhan
    International Forum on Mechanoluminescence and Novel Structural Health Diagnosis 2011  2011/11
  • Novel beam profile indicator for swift heavy ions  [Not invited]
    Tianzhuo Zhan
    220th ECS Meeting  2011/10
  • Remarkable enhancement of swift heavy ion irradiation on SrAl2O4: Eu2+ afterglow  [Not invited]
    Tianzhuo Zhan
    220th ECS Meeting  2011/10
  • Mechanoluminescent film sensor for visualizing ultrasonic power distribution  [Not invited]
    Tianzhuo Zhan
    3rd International Congress on Ceramics  2010/11
  • 応力発光薄膜を用いた超音波強度分布の直接可視化  [Not invited]
    詹天卓
    第57回 応用物理学関係連合講演会  2010/03

Research Grants & Projects

  • IoT社会を実現するマルチ環境発電材料・デバイス国際研究拠点形成
    日本学術振興会:Core-to-Core Program
    Date (from‐to) : 2020/04 -2025/03
  • Thermal management of ruthenium and graphene interconnects in next-generation VLSI circuits
    Japan Society for the Promotion of Science:Grants-in-Aid for Scientific Research Grant-in-Aid for Scientific Research (C)
    Date (from‐to) : 2021/04 -2024/03 
    Author : ジャン テンゾウ
  • 次世代ロジック半導体における配線の熱マネジメントに向けたlow-k 層間絶縁膜の界面熱抵抗に関する研究
    公益財団法人村田学術振興財団:研究助成
    Date (from‐to) : 2021/12 -2022/11
  • 最先端ロジック半導体における熱マネジメントに向けた配線金属と層間絶縁膜の界面熱抵抗に関する研究
    公益財団法人ヒロセ国際奨学財団:研究助成
    Date (from‐to) : 2020/01 -2022/01

Teaching Experience

  • Workshop on Advanced EquipmentWorkshop on Advanced Equipment Toyo University
  • Fundamental Practice of Bio-Nano ScienceFundamental Practice of Bio-Nano Science Toyo University
  • Introduction of NanomaterialsIntroduction of Nanomaterials Toyo University
  • Nano ScienceNano Science Toyo University
  • Electron DeviceElectron Device Waseda University